Thanks Joel, I think TLA2528 might be the best option for now. Sorry about the delayed response. Additional application info: I think a point of load offering would be incredibly valuable. Similar to point of load power where the regulator is placed at the load for minimised inductance/resistance, and improved remote sensing. However, the other benefit is that this significantly reduces the number of power planes needed since more power rails have less distance to travel, unless some rails are needed in multiple locations and can follow point of load topology. In the case of the ADC, having a single channel option that can have 32 or more addresses, would mean only having to route an I2C bus around the board, instead of multiple ADC lines. This is extremely helpful when trying to reduce the number of signal layers, or when trying to make better use of signal layers when routing many differential pairs, or high speed signals, or other things. In my specific case, I have 3 PCBs in a stack, with 2 of those directly hanging off the base board. Routing a single I2C bus between boards is much easier than having to route many ADC lines. The I2C bus consumes significantly less pins on the board to board connectors. This makes placement planning much easier for me, and gives back some much needed Z axis space to the mechanical team. Alternatively, if the mech team is happy and if I have the room, I just get more pins for other things. Being able to drop an ADC wherever it's needed massively improves the system architecture for the multi-board project, but also the floor planning and the layer stack and routing efficiency of the individual boards. I also like applying point of load topology to TMP1075 for temperature sensing. Kind regards, Dan
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