Part Number: LMP92066 Hello support team, I have a question regarding thermal pad of LMP92066 . Our customer wants to know the height value of the thermal pad . On page 62 of the datasheet, there is a package drawing of the PWP0016A. However, there is no information on the height from the seating plane (bottom of the lead) to the thermal pad. Referring to Figure 18 of Application Note SLMA002H ( www.ti.com/.../slma002h.pdf) , I guess the thermal pad and mold surface of the package bottom are on the same surface. But I could not find the description where the specific values were clearly stated regarding the height from the seating plane to the thermal pad, or the gap between the package bottom and the thermal pad. Could you teach me the material that is described the concrete figures. Sincerely, M. Tachibana
↧