Not asking about connecting the thermal pad to AVSS (we are going to do that). My question is does the thermal pad play a role in the thermal management of the IC? Does the physical implementation of the PCB pad matter? My question is should we bond the thermal pad PCB landing to a larger copper layer with multiple vias? If the purpose of the thermal pad is entirely physical (just to physically attach the IC to the PCB), then we should be able to just have an AVSS pour for the thermal pad on the top layer of the PCB. I am asking because understanding the point of the thermal pad reduces the likelihood of me doing something stupid with it.
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